Cambridge, UK, March 2010 — Datapaq, the world's leading supplier of temperature profiling systems, recently introduced three new products in their SolarPaq series for photovoltaic cell and module manufacturers. The new products will be on display at the 6th Photovoltaic Technology Show 2010, April 27-29 in Stuttgart, Germany, as well as other tradeshows around the world.
Datapaq designed the innovative SolarPaq systems to provide temperature-profiling solutions for the contact firing, anti-reflective coating and lamination processes. These operations are all key to the quality and performance of the final photovoltaic cell and hence, module. The SolarPaq system travels through the furnace or thermal process, measuring a time temperature profile directly from the product.
The SolarPaq Anti-reflective Coating System provides temperature profiles from the solar cells as they pass through the silver nitride coating process. This is typically conducted using a plasma sputtering process and users can now for the first time monitor the cell temperature profile even with the plasma energized. This system has been designed so that it simply takes the place of one of the cells in the carrier, thus no modification is required to the expensive carrier.
Incorporating feedback from process engineers using the Datapaq profiling system in contact firing furnaces, the SolarPaq Contact Firing Cell Clamp is paired with custom-designed thermocouple probes to ensure accurate and repeatable measurements—the foundation for any process optimization.
The SolarPaq Vacuum Lamination System is used to profile the final assembly stage of the solar modules. An all-new thermal barrier ensures that the data logger is protected from not only the heat of the lamination process, but also the external pressure that is applied. A unique external barrier frame eliminates the risk of any stress points being created on the vacuum membrane.For a high-resolution product graphic, please e-mail the appropriate contact for your region indicated above.
The benefits of combining RF telemetry and temperature profiling speak for themselves. Before the Datapaq datalogger has even left the furnace, oven or kiln, you will have the information necessary in real time to make any adjustments needed in your process to insure product quality and reduce scrap. For many batch processes, such information may permit significant reduction in cycle times, thereby increasing productivity and reducing energy costs. In optimization or validation studies, the ability to see the effect of process parameters on the temperature profile can significantly help reduce process set-up times and allow quicker production start up.
Founded in 1984, Datapaq, a Fluke company, has joined Ircon and Raytek as Global Experts in Temperature Measurement & Profiling. Datapaq manufactures in-process temperature profiling systems that provide key information on the effectiveness of industrial heating processes. Using the most advanced and tested techniques for accurately gathering and storing information, Datapaq has created industry specific standards to analyze, synthesize and report information in a precise and succinct manner. Recognized as an industry leader, our products serve automotive, finishing, solar manufacturing, can manufacturing, textile processing, ceramic manufacturing, PCB surface mounting, heat-treating, and food processing industries throughout the world. For more information, visit www.datapaq.com, www.ircon.com or www.raytek.com.