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Home > News & Events > Press Release > Datapaq at SMT Hybrid Packaging

Datapaq at SMT Hybrid Packaging

Temperature profiling solution for reflow soldering now includes Easy Oven Setup software free of charge
March 17, 2015

Cambridge, UK – At the 2015 SMT Hybrid Packaging exhibition in Nuremberg, Datapaq will present temperature profiling solutions tailored to the electronics industry. The manufacturer provides both measurement technology based on the established Q18 data logger series and highly effective analysis software. The Easy Oven Setup (EOS) software is now included free-of-charge with every Datapaq Reflow Tracker. The user-friendly program automatically calculates the oven settings for specific products and ovens. This renders repeated trial-and-error runs unnecessary, saving considerable time and effort at every line change. Reflow Tracker systems record complete temperature profiles of reflow soldering processes via thermocouples. The systems pass through the entire process along with the printed circuit boards. They are also used in wave, vapor phase, and selective soldering, and at rework stations. Automatic analysis, traffic light signals, and programmable alarms instantly show whether the profile is within the tolerance limits. Trend analyses enable preventive adjustments and thereby support maximum utilization of capacities.

Datapaq Reflow Trackers for temperature profiling Figure: Datapaq Reflow Trackers for temperature profiling now include Easy Oven Setup software free of charge

Datapaq at the SMT Hybrid Packaging exhibition
Nuremberg, Germany, 5-7 May 2015
Hall 7, Stand 539

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