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Home > News & Events > Press Release > HeatTreatmentCongress 2016

HeatTreatmentCongress Cologne: new high-precision, high-value 20-channel temperature data logger

May 25, 2016

At the forthcoming HeatTreatmentCongress in Cologne, Germany, Fluke Process Instruments (hall 4.1, stand B-071) will be exhibiting temperature profiling systems tailored to steelworks and metals processing applications. The new DATAPAQ TP3 data logger connects up to 20 thermocouples and stores up to 3.6 million data points. It provides detailed, high-quality data to help users save time and boost productivity. The measured temperature range is -100 °C to +1,370 °C with an excellent ±0.3 °C accuracy. The loggers perform temperature uniformity surveys (TUS) and system accuracy tests (SAT) compliant with AMS 2750E and CQI-9. An onboard digital calibration certificate and automatic measurement correction functions prevent human errors and save time on reporting.

DATAPAQ TP3 Data Logger Illustration: DATAPAQ TP3 - available with 10 or 20 thermocouple channels - provides for reliable, detailed, time-saving temperature profiling in demanding thermal processes

Thermal and ingress protection have been enhanced to ensure optimal performance in extreme applications, including vacuum brazing, aluminum solution reheat, and water or gas quench. Users can set variable sampling intervals to capture fast temperature changes when needed. They can also execute up to ten consecutive measurement runs before downloading the data via Bluetooth or USB. An optional radio telemetry feature enables live process monitoring. Loggers can be pre-configured for mixed thermocouple types. They can be powered with any of three user-interchangeable battery types: Lithium, Alkaline, or rechargeable NiMH batteries. Fluke Process Instruments offers complete application-tailored system solutions including resilient thermal barriers, Insight analysis software, and thermocouples.

Fluke Process Instruments at the HeatTreatmentCongress
Koelnmesse, Cologne, Germany, 26-28 October, 2016
Hall 4.1, stand B-071

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