Datapaq reflow temperature profile systems provide reliable and accurate in process temperature profiling for reflow, wave solder,
vapor phase, tack/cure, rework stations and solder mask ovens.
Datapaq reflow profile systems provide up to 60,000 data points with a sampling intervals of 0.1 sec for the most detailed temperature profiles available. These reflow profile systems are accurate to within +/- 1Cº.The channels of the integral data logger are calibrated individually to ensure accuracy and meet ISO 9000 requirements. These systems also feature thermocouples that are twice as accurate as standard thermocouples.
Datapaq reflow profile systems include rugged, easy-to-use thermal barriers made from high-grade stainless steel and feature secure button closures. These barriers can withstand process temperatures as high as 300ºC for use in most reflow ovens. Additionally, these barriers are available in a wide variety of shapes and sizes to easily fit into any oven.
Insight software shows all the critical profile results in one easy to read table.
Datapaq reflow profile systems also include Insight software, the latest development in thermal profiling software. This software is designed to combine powerful analysis features with an easy-to-use interface. This software features several wizards for ease of use, a reflow results table to speed analysis, alarms for instant GO-NO GO indication, and full support for wave solder analysis, including all the critical wave parameters in one easy-to-read table. Click here to download a free demo of the Insight software.
Our customer service department would be happy to answer any questions you have about any of our reflow temperature profiling systems. Call Datapaq at 978-988-9000 (North & South America) +44 1223 423141 (for our European and Far East Offices), or
fill out this online contact form.
Temperature profile systems for reflow ovens
These reflow temperature profile systems can be used to rapidly set up new processes, identify and solve problems before they
affect quality or productivity, increase productivity, prove process control, minimize fuel costs, and control product quality.
Datapaq is proud to offer high temperature data loggers for a wide range of applications including
Oven,
Furnace,
Kiln,
Food, and
Reflow.
Datapaq reflow profile systems provide accurate and detailed in-process reflow temperature profiles
Reflow temperature profile systems are suitable for a wide range of reflow processes
Thermal profiling software simplifies reflow profile analysis and ISO compliance
Learn more about Datapaq reflow temperature profile systems
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